We look forward to receiving your abstract submission for either of the two conferences. Abstracts will be managed separately for each conference using ConfTool. This tool has been successfully used by the EIC for the last few events, therefore the IPMHVC will be using this tool for the 2022 conference instead of the Indico site used in previous events.
Submissions to either the IEEE Electrical Insulation Conference (EIC) or IEEE International Power Modulator and High Voltage Conference (IPMHVC) can be entered using the Submit buttons below that links to the ConfTool system.
IEEE copyright form is required for all submitted papers. Papers must be presented at the Conference in order to be considered for placement on IEEE Xplore.